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                      | HITACHI HOME | UP | SEARCH | HITACHI

                      News Release ^
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                      December 27, 1999

                      Hitachi and UMC to Establish 300mm Wafer Semiconductor Joint Venture

                      Hitachi, Ltd. (Hitachi) (NYSE: HIT) and United Microelectronics Corporation (UMC) 
                      today announced that they have come to an agreement regarding the principal terms of a 
                      joint venture company to manufacture 300mm wafers with leading-edge process 
                      technologies of 0.18-micron and beyond. The new company will be based in the N3 
                      building of Hitachi's LSI Manufacturing Operation in Hitachinaka-city, Ibaraki 
                      prefecture, Japan. The site is expected to become a strategic manufacturing facility for 
                      both Hitachi and UMC, combining Hitachi's advanced process and manufacturing 
                      technology with UMC's advanced technology and world-class silicon foundry expertise. 
                      Half of the capacity of the joint venture will be reserved for Hitachi's products, with the 
                      other half reserved for products supplied to UMC's foundry customers. The joint 
                      venture will be established by the end of February 2000 and start manufacturing 
                      operations from 2001. 
                      
                      "The semiconductor market is expected to continue growing, driven by rapidly 
                      increasing demand for electronic devices, such as PCs, mobile communications and 
                      digital consumer products. Through the joint venture, Hitachi and UMC will better meet 
                      the growing demand for advanced ICs, including next-generation system-on-chip 
                      designs. Hitachi and UMC expect that the joint investment will accelerate the ramping-
                      up of production and maximize returns on investment for the new company," said 
                      Hitachi's Tadashi Ishibashi, President & Chief Executive Officer of Semiconductor & 
                      Integrated Circuits.
                      
                      "This joint venture will result in one of the world's first 300mm wafer plants in mass 
                      production. It is being established in response to strong customer demand for advanced 
                      technologies and increased capacity. With the wealth of technological and 
                      manufacturing expertise that UMC and Hitachi bring to this venture, we are confident 
                      of its success. Our foundry customers will welcome this partnership," said Robert Tsao, 
                      Chairman of UMC. 
                      
                      Hitachi will contribute its 0.18-micron and beyond process technology, as well as its 
                      experience in the development of 300mm manufacturing systems. UMC will also 
                      contribute its 0.18-micron and beyond technology to the company, as well as provide a 
                      wealth of know-how in silicon foundry operations. The synergy created by the 
                      combination of the two companies' expertise will ensure that the joint venture leads the 
                      industry in the mass production of 300mm wafers, and also provides world-leading 
                      cost-performance and quick turn around times (QTAT). 
                      
                      
                      Outline of Joint Venture
                      Company Name:	 To be decided
                      Head Office:	 751 Horiguchi, Hitachinaka-city, Ibaraki prefecture, Japan
                      	 (Currently, N3 building of Hitachi's LSI Manufacturing Operation)
                      Establishment:	 End of February 2000
                      Equity Position: Hitachi 60%, UMC 40%
                      Representative:	 To be assigned by Hitachi
                      Business:	 Manufacture and sales of semiconductors
                      Production:	 Pilot production starts in January 2001
                      		 Mass production starts in April 2001
                      Capacity:	 7,000 wafers per month by 300mm in the 2nd half of 2001
                      Initial Investment: Approx. 70 billion yen for 7,000-wafer capacity
                      
                      
                      About Hitachi, Ltd.
                      Hitachi, Ltd., headquartered in Tokyo, Japan, is one of the world's leading global 
                      electronics companies, with fiscal 1998 (ended March 31, 1999) consolidated sales of 
                      7,977 billion yen ($65.9 billion*). The company manufactures and markets a wide range 
                      of products, including computers, semiconductors, consumer products and power and 
                      industrial equipment. For more information on Hitachi, Ltd., please visit Hitachi's web 
                      site at http://www.hitachi.co.jp.
                      *At an exchange rate of 121 yen to the dollar
                      
                      
                      About United Microelectronics Corporation
                      UMC is a world leading semiconductor foundry with eight wafer fabs (including six 
                      8"fabs) located in Taiwan's Hsinchu Science Park. UMC also operates the only 
                      dedicated foundry in Japan, Nippon Foundry Inc. (NFI). UMC is a leader in foundry 
                      technology and expects capacity to reach 2.4 million wafers per year in 2000 with over 
                      50% for 0.25-micron and beyond technologies. UMC is currently in volume production 
                      of 0.18-um technology and will offer copper-interconnect and 0.15-micron logic 
                      technology to its foundry customers in the first quarter of 2000. The company has 
                      started construction on a 300mm facility in Taiwan that is expected to enter production 
                      by mid-year 2001 with a design capacity of 30,000 wafers per month. UMC has 
                      marketing and customer support offices located in the United States, Japan, and the 
                      Netherlands. UMC can be found on the web at http://www.umc.com.tw.
                      


                      WRITTEN BY Secretary's Office
                      All Rights Reserved, Copyright (C) 1999, Hitachi, Ltd.

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