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                      | HITACHI HOME | UP | SEARCH | HITACHI
                      News Releases Corporate Profiles

                      March 21, 2000
                      Hitachi-UMC 300mm Joint Venture Company Established as Trecenti Technologies
                      #
                      Tokyo and Taipei-- Hitachi, Ltd. (Hitachi) (NYSE: HIT) and United Microelectronics 
                      Corporation (UMC) today announced the official establishment of their joint wafer fab 
                      company. The name "Trecenti Technologies, Inc." (Trecenti Technologies) has been 
                      chosen for the new company, and it will operate from the N3 building of Hitachi's LSI 
                      Manufacturing Operation in Hitachinaka-city, Ibaraki prefecture, Japan. Trecenti 
                      Technologies will manufacture 300mm wafers utilizing leading-edge process 
                      technologies of 0.18-micron and beyond.
                      
                      "We are excited about the start of the new joint venture. Our team is extremely 
                      confident of its ability to quickly bring the 300mm wafer facility to volume production, 
                      due to the combined expertise of UMC and Hitachi," said Toshio Nohara, President of 
                      Trecenti Technologies. "The company name "Trecenti" comes from the Latin word 
                      "trecenti," which means "three hundred" (300). This clearly reflects our commitment to 
                      become a pioneer of 300mm wafer manufacturing technology. Trecenti Technologies 
                      will respond to the growing needs of our customers with quick turn-around-times and 
                      cost-effective manufacturing."   
                      
                      H. J. Wu, General Manager of UMC and Board Director of Trecenti Technologies, said 
                      "Our plan is to offer the advantages of 300mm technology to our customers in the 
                      shortest timeframe possible. Clearly, Trecenti will benefit from the synergies created by 
                      the alliance of Hitachi and UMC, and we expect to set the standard for 300mm wafer 
                      manufacturing performance in the global semiconductor industry."   
                      
                      
                      Outline of Trecenti Technologies, Inc.
                      
                      Head Office:	751 Horiguchi, Hitachinaka-city, Ibaraki prefecture, Japan
                      	 	(Currently, N3 building of Hitachi's LSI Manufacturing Operation)
                      Establishment:	March 15, 2000
                      Capital:	2,500 million yen
                      		(30,000 million yen, by end of December, 2000)
                      Equity Position: Hitachi 60%, UMC 40%
                      Representative Director and President:	
                      		Toshio Nohara  (Semiconductor & IC group, Hitachi)
                      Directors:	Mutsumi Suzuki  (Corporate Auditor's Office, Hitachi) 
                      		Osamu Minato  (Hitachi Nippon Steel Semiconductor Singapore)
                      		Atsuyoshi Koike  (Semiconductor & IC group, Hitachi)
                      		H. J. Wu  (General Manager, UMC)
                      		Jenn Tsao  (Project Director, UMC)
                      		Mitsuo Takahashi  (Vice President, Nippon Foundry)
                      Auditors:	Katsuhiko Katayama  
                      			(Hitachi Nippon Steel Semiconductor Singapore)
                      		Kenji Mukaiyama  (Semiconductor & IC group, Hitachi)
                      		P. K. Hung  (Director, Nippon Foundry)
                      Employees:	Approx. 450 at full production in the 2nd half of 2001
                      Business:	Manufacture and sale of semiconductors
                      Schedule:	Pilot production starts in January 2001
                      		Mass production starts in April 2001
                      Capacity:	7,000 300mm wafers per month in the 2nd half of 2001
                      Initial Investment:Approx. 70 billion yen for 7,000-wafer capacity
                      
                      
                      About Hitachi, Ltd.
                      Hitachi, Ltd., headquartered in Tokyo, Japan, is one of the world's leading global 
                      electronics companies, with fiscal 1998 (ended March 31, 1999) consolidated sales of 
                      7,977 billion yen ($65.9 billion*). The company manufactures and markets a wide range 
                      of products, including computers, semiconductors, consumer products and power and 
                      industrial equipment. For more information on Hitachi, Ltd., please visit Hitachi's web 
                      site at http://www.hitachi.co.jp.
                      *At an exchange rate of 121 yen to the dollar
                      
                      
                      About United Microelectronics Corporation
                      UMC, a world leading semiconductor foundry, operates fabs in Taiwan and Japan and 
                      has two 12-inch fabs under construction, including a joint venture company with 
                      Hitachi, Ltd. of Japan. UMC is a leader in foundry technology and expects capacity to 
                      reach 2.4 million wafers per year in 2000 with over half in advanced 0.18 and 0.25-
                      micron technology. UMC will introduce WorldlogicTM standard 0.13-micron process 
                      technology in year 2000. Global sales were $1.75 billion in 1999. UMC has marketing 
                      and customer support offices located in the United States, Japan, and the Netherlands. 
                      UMC can be found on the web at http://www.umc.com
                      




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                      WRITTEN BY Secretary's Office
                      (C) Hitachi, Ltd. 2000. All rights reserved.

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